User's Guide

LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 Preliminary 2015-09-02 58 of 68
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Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
Ramp-up Rate
3°C/second max
Time maintained above:
Temperature (TL)
Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
WARNING:
THE LE866 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.