User's Guide

LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 Preliminary 2015-09-02 57 of 68
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Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness
of stencil foil ≥ 120 µm.
Solder paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after
assembly.
Solder reflow
Recommended solder reflow profile: