LE866 HARDWARE USER GUIDE PRELIMINARY 1vv0301210 Rev.
APPLICABILITY TABLE PRODUCTS LE866-SV1 LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
DISCLAIMER LEGAL NOTICE These Specifications are general guidelines pertaining to product selection and application and may not be appropriate for your particular project. Telit (which hereinafter shall include, its agents, licensors and affiliated companies) makes no representation as to the particular products identified in this document and makes no endorsement of any product.
HIGH RISK MATERIALS Components, units, or third-party products contained or used with the products described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities").
CONTENTS 1 Introduction 8 Scope 8 Audience 8 Contact Information, Support 8 List of acronyms 9 Text Conventions 10 1.6. Related Documents 10 2 3 Overview Pins Allocation 11 12 Pin-out 12 LGA Pads Layout 17 4 Power Supply 18 Power Supply Requirements 18 Power Consumption 19 General Design Rules 20 Electrical Design Guidelines 20 4.3.1.1 +5V Source Power Supply Design Guidelines 20 4.3.1.2 + 12V input Source Power Supply Design Guidelines 21 4.3.1.
General Purpose I/O 38 Using a GPIO as INPUT 39 Using a GPIO as OUTPUT 39 Indication of network service availability 39 SIMIN Detection 40 External SIM Holder 41 ADC Converter 42 DAC Converter 43 Enabling DAC 43 LOW Pass filter Example 44 RF Section 45 Bands Variants 45 TX Output Power 45 RX Sensitivity 45 Antenna Requirements 46 Main Antenna 46 RX Diversity Antenna 47 PCB design guidelines 47 PCB Guidelines in case of FCC Certification 49 6.4.4.
11 12 13 Moisture sensitivity 61 SAFETY RECOMMANDATIONS FCC/IC Regulatory notices Document History 62 63 66 Revisions 66 LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
1 INTRODUCTION Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE866 module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our LE866 modules. Contact Information, Support For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at: TS-EMEA@telit.com TS-AMERICAS@telit.
List of acronyms Acronym Description TTSC Telit Technical Support Centre USB Universal Serial Bus HS High Speed DTE Data Terminal Equipment LTE Long Term Evolution WCDMA Wideband Code Division Multiple Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access UART Universal Asynchronous Receiver Transmitter HSIC High Speed Inter Chip SIM Subscriber Identification Module SPI Serial Peripheral Interface ADC Analog – Digital Converter DAC Digital – Analog
Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1.6.
2 OVERVIEW The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE866 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed.
3 PINS ALLOCATION Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 COMMUNICATION PORT E5 USB_D+ I/O USB differential Data (+) - E6 USB_D- I/O USB differential Data (-) - Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control A4 C103/TXD I Serial data input (TXD) from DTE CMOS 1.8V A5 C104/RXD O Serial data output to DTE CMOS 1.8V A2 C108/DTR GPI_E I Input for (DTR) from DTE Alternate Function: GPIO CMOS 1.
D6 GPIO_03 DVI_TX SIM_IN I/O INT General Purpose IO Alternate Function 1: Digital Audio Interface (TX) Alternate Function 2: SIM_IN CMOS 1.8V D5 GPIO_04 DVI_CLK TX_DISABLE SIM_IN I/O INT Main Function: GPIO04 Configurable GPIO Alternate Function1: Digital Audio Interface (CLK) Alternate Function 2: TX Disable input Alternate Function 3: SIM_IN CMOS 1.
E3 GND - Ground Power F3 GND - Ground Power G3 GND - Ground Power F6 GND - Ground Power A8 GND - Ground Power G8 GND - Ground Power A11 GND - Ground Power G11 GND - Ground Power RESERVED A0 RESERVED - RESERVED D3 RESERVED - RESERVED G5 RESERVED - RESERVED B6 RESERVED - RESERVED D7 RESERVED - RESERVED E7 RESERVED - RESERVED F7 RESERVED - RESERVED G7 RESERVED - RESERVED B8 RESERVED - RESERVED C8 RESERVED - RESERVED E8 RESERVED -
B11 RESERVED - RESERVED C11 RESERVED - RESERVED D4 RESERVED - RESERVED F5 RESERVED - RESERVED F11 RESERVED - RESERVED E11 RESERVED - RESERVED D11 RESERVED - RESERVED WARNING: Reserved pins must not be connected LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
If not used, almost all pins should be left disconnected.
LGA Pads Layout TOP VIEW A B C D E F G 0 RESERVED GND DIV ANT GND VBATT_PA GND GND 1 C105/RTS C106/CTS TX AUX GND VBATT_PA GND GND 2 C108/DTR C109/DCD RX AUX GND VBATT GND MAIN ANT 3 C107/DSR C125/RING GND RESERVED GND GND GND 4 C103/TXD GPIO_06 GPIO_07 RESERVED DAC_OUT ADC_IN1 RESET* 5 C104/RXD GPIO_05 GPIO_01 GPIO_04 USB_D+ 6 SIMIO RESERVED GPIO_02 GPIO_03 USB_D- 7 SIMCLK SIMRST SIMVCC 8 GND 9 RESERVED RESERVED RESERVED RESERVED GND VAU
4 POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. Power Supply Requirements The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements: Power Supply Value Nominal Supply Voltage 3.8V Normal Operating Voltage Range 3.40 V÷ 4.
Power Consumption Mode Average (mA) Mode Description AT+CFUN=5 TBD Disabled TX and RX; DRX7 LTE Voice Call TBD Max Power LTE Data Call (Max Power) TBD LTE data call LTE Data Call (Min Power) TBD LTE data call NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 1 A. LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: the electrical design the thermal design the PCB layout. Electrical Design Guidelines The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories: +5V input (typically PC internal regulator output) +12V input (typically automotive) Battery 4.3.1.
4.3.1.2 + 12V input Source Power Supply Design Guidelines The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency. When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response.
4.3.1.3 Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit LE866 module. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
4.3.1.4 Thermal Design Guidelines The thermal design for the power supply heat sink should be done with the following specifications: Average current consumption during LTE transmission @PWR level max : 600 mA Average current during idle: 1.5 mA Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls.
4.3.1.5 Power Supply PCB layout Guidelines As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes The placement of this component is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
RTC The LE866 module is provided by an internal RTC section but its reference supply is VBATT. So, in order to maintain active the RTC programming, VBATT should not be removed VAUX Power Output A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad G6 and it is in common with the PWRMON (module powered ON indication) function. This output is always active when the module is powered ON.
5 DIGITAL SECTION Logic Levels Specification ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL: Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V Parameter Min Max Input high level 1.55V 1.9V Input low level 0V 0.35V Output high level 1.35V 1.8V Output low level 0V 0.8V OPERATING RANGE - INTERFACE LEVELS (1.8V CMOS): CURRENT CHARACTERISTICS: Parameter AVG Output Current TBD Input Current TBD LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
Power on The LE866 will automatically power on itself when VBATT & VBATT_PA are applied to the module. VAUX / PWRMON pin will be at the high logic level and the module can be considered fully operating after 5 seconds.
A flow chart showing the AT commands managing procedure is displayed below: “Start AT CMD” START Delay = 300 msec Enter AT AT answer in 1 sec ? N Disconnect PWR Supply Y “Start AT CMD” END GO TO “Modem ON Proc.” NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
Power off The following flowchart shows the proper Turn-off procedure: “Modem OFF Proc” AT#SYSHALT 10s Timeout Disconnect PWR Supply Delay 1.5s “Modem ON Proc.” In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
Reset To unconditionally reboot the LE866, the pad RESET* must be tied low for at least 200 milliseconds and then released. The maximum current that can be drained from the RESET* pad is 0,15 mA. The hardware unconditional Restart must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure to be done in the rare case that the device gets stuck waiting for some network or SIM responses.
A typical circuit is the following: NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
In the following flow chart is detailed the proper restart procedure: Modem RESET Proc. RESET* = LOW Delay = 200ms RESET* = HIGH Delay = 1s Start At CMD NOTE: Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the LE866 power regulator and improper functioning of the module.
Communication ports USB 2.0 HS The LE866 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table is listing the available signals: PAD Signal I/O Function Type E5 USB_D+ I/O USB differential Data (+) 3.3V E6 USB_D- I/O USB differential Data (-) 3.3V NOTE The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized.
Serial Ports The LE866 module is provided with by 2 Asynchronous serial ports: MODEM SERIAL PORT 1 (Main) MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: RS232 PC com port microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) microcontroller UART @ 5V or other voltages different from 1.
NOTE: According to V.24, some signal names are referred to the application side, therefore on the LE866 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD) For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.
5.5.2.2 MODEM SERIAL PORT 2 (USIF1) The secondary serial port on the LE866 is a CMOS1.8V with only the RX and TX signals. The signals of the LE866 serial port are: PAD Signal I/O Function Type NOTE C1 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V Shared with SPI_MOSI C2 RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.8V Shared with SPI_MISO NOTE: Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI functions.
In order to interface the LE866 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must: invert the electrical signal in both directions; Change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator.
General Purpose I/O The LE866 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V) Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the LE866 firmware and acts depending on the function implemented.
Also the UART’s control flow pins can be usable as GPIO: PAD Signal I/O Input/output Default ON_OFF current State state Reset State NOTE B2 GPO_A O TBD INPUT 0 0 Alternate function C109/DCD B3 GPO_B O TBD INPUT 0 0 Alternate function C125/RING A3 GPO_C O TBD INPUT 0 0 Alternate function C107/DSR A2 GPI_E I TBD INPUT 0 0 Alternate function C108/DTR A1 GPI_F I TBD INPUT 0 0 Alternate function C105/RTS B1 GPO_D O TBD INPUT 0 0 Alternate function C106/CTS U
In the LE866 modules, the STAT_LED needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.
AT#SIMINCFG Use the AT command AT#SIMDET=2 to enable the SIMIN detection Use the AT command AT&W0 and AT&P0 to store the SIMIN detection in the common profile. NOTE: Don’t use the SIM IN function on the same pin where the GPIO function is enabled and vice versa! External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
ADC Converter The LE866 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word. The input line is named as ADC_IN1 and it is available on Pad F4 The following table is showing the ADC characteristics: Item Min Typical Max Unit Input Voltage range 0 - 1.
DAC Converter The LE866 provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on pin E4 of the LE866. The on board DAC is a 10 bit converter, able to generate an analogue value based on a specific input in the range from 0 up to 1023. However, an external low-pass filter is necessary The following table is showing the ADC characteristics: Item Min Max Unit Voltage range (filtered) 0 1.
LOW Pass filter Example LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
6 RF SECTION Bands Variants The following table is listing the supported Bands: Product Supported 3G bands LE866-SV1 FDD B4, B13 TX Output Power Band Power Class FDD B4, B13 Class 3 (0.2W) RX Sensitivity Band Sensitivity FDD B4, B13 -102dBm LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
Antenna Requirements Main Antenna The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.
RX Diversity Antenna This product is including an input for a second RX antenna to improve the data throughput. The function is called Antenna Diversity (downlink MIMO) in LTE.
Ensure that the antenna line impedance is 50 ohm; Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less than 0,3 dB; Antenna line must have uniform characteristics, constant cross section; avoid meanders and abrupt curves; Keep, if possible, one layer of the PCB used only for the Ground plane; Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other signal tracks facing directly the antenna line track; T
PCB Guidelines in case of FCC Certification In the case FCC certification is required for an application using LE866-N3G, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on LE866 interface board and described in the following chapter. 6.4.4.
6.4.4.2 Transmission Line Measurements An HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load.
Insertion Loss of G-CPW line plus SMA connector is shown below: 6.4.4.3 Antenna Installation Guidelines Install the antenna in a place covered by the LTE signal. If the device antenna is located farther than 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product.
7 AUDIO SECTION Overview The LE866 is provided by one Digital Audio Interface. Digital Voice Interface The LE866 Module is provided by one DVI digital voice interface.
8 MECHANICAL DESIGN Drawing The Dimensions are in mm LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
9 APPLICATION DESIGN The LE866 modules have been designed in order to be compliant with a standard lead-free SMT process. Footprint TBD In order to easily rework the LE866 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Pad Solder Mask PCB SMD (Solder Mask Defined) NSMD (Non Solder Mask Defined) PCB pad dimensions The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm) Solder resist openings LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Inhibit area for micro-via Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.
Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Solder paste Item Lead Free Solder Paste Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. Solder reflow Recommended solder reflow profile: LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL – Ramp-up Rate 3°C/second max Time maintained above: – Temperature (TL) – Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max.
10 PACKAGING Tray The LE866 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
Moisture sensitivity The LE866 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.
11 SAFETY RECOMMANDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required.
12 FCC/IC REGULATORY NOTICES Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous: Bande de fréquence Gain Band 4 (1700 MHz) TBD Band 13 (700 MHz) TBD L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps.
13 DOCUMENT HISTORY Revisions Revision Date Changes 0 2015-03-27 Preliminary Version 1 2015-09-02 Updated chapters 3.1, 3.1.1 LE866 HARDWARE USER GUIDE 1vv0301210 Rev.
