xE70-915 RF Module User Guide 1VV0301106 rev.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 APPLICABILITY TABLE PRODUCT LE70-915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Contents 1. Introduction ................................................. 7 1.1. Scope ..................................................... 7 1.2. xE70-915 Product Description .............................. 7 1.3. Audience .................................................. 7 1.4. Contact Information, Support .............................. 7 1.5. Text Conventions .......................................... 8 1.6. Related Documents ...
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 5.2. Storage .................................................. 23 5.3. Soldering pad pattern .................................... 23 5.4. Solder paste ............................................. 24 5.5. Placement ................................................ 24 5.6. Soldering Profile (RoHS Process) ......................... 24 6. Board Mounting Recommendation ............................... 26 6.1. Electrical environment .......
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 1. Introduction 1.1. Scope Scope of this document is to present the features and the application of the Telit xE70-915 radio modules. 1.2. xE70-915 Product Description The xE70-915 module is a multi-channel radio board, delivering up to 500mW in Frequency Hopping technology. It is compliant with the FCC Code of Federal Regulations [1] in the 915 MHz ISM unlicensed frequency band.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. 1.5. Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 2. Regulatory Conformance Information 2.1. Operational Frequency Bands The module radio transmitter operations must be compliant with some regulatory requirements in terms of frequency bands and emitted power, as detailed below. 2.1.1. 915 MHz Band Requirements The FCC part 15.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3. General Features 3.1. Main Functionalities The xE70-915 module is a complete solution from serial interface to RF interface. The xE70915 module has a digital part and a RF part. The radio link is a Half Duplex bi-directional link.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.4. Mechanical Specifications Size Rectangular 25.8 x 15 mm Height 3 mm Weight 1.7 g PCB thickness 0.8 mm Cover Mounted above SMD components for EMI reduction and automatic placement • Dimensions : 25 x 14.2 x 2.2mm • Thickness : 200µm Components All SMD components, on one side of the PCB.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.5. Mechanical dimensions Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.6. DC Specifications Measured on DIP interface with T = 25°C, under 50Ω impedance connected to RF port and default power register setting if nothing else stated. Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2.3V to 3.6V and all channels. Characteristics xE70-915 Min. Typ. Max. Unit Power Supply (VDD) +2.3 - +3.6 V Maximum output power 500mW (+27dBm) 390 420 mA Reception 25 30 mA Stand-by (32.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.7. Radio Specifications Measured on DIP interface at T = 25°C, Vdd = 3.6V, 50 Ω impedance and default power register setting if nothing else stated. 902 MHz - 928 MHz Frequency Band RF data rate 9.6 kbps 19.2 kbps 38.4 kbps Number of channels 57.6 kbps 50 Channel spacing 250 kHz First Channel 915.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.8. Digital Specifications Function Characteristics µC Serial link • 128 kB + 8 kB in system programmable flash • 8 kB RAM • 2 kB E2PROM • RS232 TTL Full Duplex • 1200 to 115200 bps • 7 or 8 bits • Parity management • Flow control o Hardware (RTS/CTS) • Flexibility: o Pre flashed o Customization capability o Embedded bootloader for firmware download through serial link or over the air Embedded software functionality 3.9.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Equipment and Part Number SMD Version B LE70-915/SMD DIP Version B LE70-915/DIP Demo Case D LE70-915 DemKit Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4. Pin-out and Signals Description 4.1. Module Pin-out (Top View) CAUTION: reserved pins must not be connected CAUTION: In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since reserved on these modules (see foot notes on PinOut tables. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4.2.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 J2 IO2_P RX LED J1 IO1_P TX LED 4.3. I/O TTL Logic I/O N°2 with interrupt O TTL See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide I/O TTL Logic I/O N°1 with interrupt O TTL See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide Pin-out of the Module DIP Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4.4.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4.5. Signals Description Signals Description Reset External hardware reset of the radio module. Active on low state. TXD, RXD Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state. CTS Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state). RTS Outgoing signal.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 5. Process Information 5.1. Delivery xE70-915 modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 5.2. Storage The optimal storage environment for xE70-915 modules should be dust free, dry and the temperature should be included between -40°C and +85°C. In case of a reflow soldering process, radio modules must be submitted to a drying bake at +125°C during 24 hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 5.4. Solder paste xE70-915 module is designed for reflow soldering process. For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 µm. 5.5. Placement The xE70-915 module can be automatically placed on host boards by pick-and-place machines like any integrated circuit 5.6.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 The barcode label located on the module shield is able to withstand the reflow temperature. CAUTION - It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the xE70-915 radio module’s metal shield from being in contact with the solder wave. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6. Board Mounting Recommendation 6.1. Electrical environment The best performances of the xE70-915 module are obtained in a “noise free” environment. Some basic recommendations must be followed: • Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus,...) must be placed as far as possible from the xE70-915 module.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout: • It is recommended to fill all unused PCB area around the module with ground plane • The radio module ground pin must be connected to solid ground plane. • If the ground plane is on the bottom side, a via (metal hole) must be used in front of each ground pad.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6.4. Antenna connections on printed circuit boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6.5. xE70-868/915 Interfacing Example of a full RS-232 connection between a PC or an Automat (PLC) and xE70-868/915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Example of minimum connections for communication between a PC and xE70-868/915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Example for sensor connection with xE70-868/915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 7. Conformity assessment issues FCC/IC Regulatory notices 7.1. Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature.
xE70-915 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 Cet appareil est conforme aux limites d'exposition aux rayonnements de l’IC pour un environnement non contrôlé. L'antenne doit être installée de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain et Type de l'antenne doit être ci-dessous: Type Antenne dipole λ/2 Gain maximum 1.9 dBi L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
xE70-915 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit : Contains FCC ID: RI7LE70FH Contains IC: 5131A-LE70FH 7.6. CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 8. Safety Recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. • Where there is risk of explosion such as gasoline stations, oil refineries, etc.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 9. Glossary ACP AFA bps BW dB dBm E2PROM E.R.
¡Error! No se encuentra el origen de la referencia. 1VV0301106 rev.4 – 2015-06-16 10.
