User's Manual

HE920 Hardware User Guide
1vv0301014 Rev.9 – 2014-01-23
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Reserved. Page 67 of 84
13.4. Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120 µm.
13.5. PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.