Hardware Manual
Manuals
Brands
Telit Communications Manuals
Electronics
2G/3.5G module, HE910-NAG V2, HE910-NA V2
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Lead free
Solder Paste
Sn/Ag/Cu
We
recommend
using
only
“no
clean”
solder
paste
in
order
to
avoid
the
cleaning
of
t
he
modules after as
sembly.
Recomm
ended solder reflow profil
e:
1
...
...
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65
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