Hardware Manual
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Telit Communications Manuals
Electronics
2G/3.5G module, HE910-NAG V2, HE910-NA V2
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Stencil’s
apertures
layout
can
be
the
same
as
the
recomm
ended
footprint
(1:1)
,
we
suggest
a
th
ickness o
f stencil foil
≥ 120
µ
m.
Non solder mask
defined (NSMD) type i
s recommended fo
r the solder pads on the PCB.
1
...
...
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62
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