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Contents 4.2.2.
The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910-EU/EUG V2 HE910-NA/NAG V2 module. All the features and solutions detailed are applicable to all HE910 V2, whereas “HE910 V2” is intended the modules listed in the applicability table. When a specific feature is applicable to a specific product, it will be clearly highlighted.
This document contains the following chapters: Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support information, and text conventions. Chapter 2: “General Product Description” gives an overview of the features of the product. Chapter 3: “HE910 V2 Module Connections” deals with the pin out configuration and layout. Chapter 4: “Hardware Commands” How to operate the module via hardware. Chapter 5: “Power supply” Power supply requirements and general design rules.
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE10 V2 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed.
Upload Download HSUPA HSDPA (Mbps) (Mbps) EMEA/APAC/Latin American markets HE910-EU V2 5.76 14.4 HE910-EUG V2 5.76 14.4 North American markets HE910-NA V2 5.76 14.4 HE910-NAG V2 5.76 14.4 Variant name HE910 V2 Variants Frequencies Features UMTS/HSPA+ GSM/GPRS/EDGE Data bands(MHz) Quad-band Voice GPS 900, 2100 900, 2100 ■ ■ ■ ■ ■ ■ ■ 850, 1900 850, 1900 ■ ■ ■ ■ ■ ■ ■ The Telit HE910 V2 module overall dimensions are: • Length: 28.2 mm • Width: 28.2 mm • Thickness: 2.
Operating Temperature Range –40°C ~ +85°C Storage and non-operating Temperature Range –40°C ~ +90°C As a part of Telit’s corporate policy of environmental protection, the HE910 V2 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA modes are conformed to the 3GPP specifications. Mode Freq. TX (MHz) Freq. RX (MHz) Channels TX - RX offset GSM850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz 890.0 ~ 914.8 935.0 ~ 959.8 0 ~ 124 45 MHz 880.2 ~ 889.8 925.2 ~ 934.8 975 ~ 1023 45 MHz DCS1800 1710.2 ~ 1784.8 1805.2 ~ 1879.8 512 ~ 885 95MHz PCS1900 1850.2 ~ 1909.8 1930.2 ~ 1989.
Pin Signal I/O Function USB HS 2.0 Communication Port I/O USB differential Data(+) B15 USB_D+ I/O USB differential Data(-) C15 USB_DI Power sense for the internal USB transceiver A13 VBUS Asynchronous UART – Prog.
Pin Signal RF Section ANTENNA K1 GPS Section ANT_GPS R9 GPS_LNA_EN R7 Miscellaneous Function I/O Function Type I/O CDMA Antenna (50Ohm) RF I O GPS Antenna (50Ohm) Output enable for External LNA supply RF CMOS 1.8V CMOS 1.
Pin Signal GND P6 GND R6 GND P8 GND R8 GND P9 P10 GND R10 GND M12 GND B13 GND P13 GND E14 GND Reserved Reserved C1 Reserved D1 Reserved B2 Reserved C2 Reserved D2 Reserved B3 Reserved C3 Reserved D3 Reserved E3 Reserved F1 Reserved F3 Reserved G3 Reserved H3 Reserved J3 Reserved K3 Reserved L3 Reserved B4 Reserved C4 Reserved B5 Reserved C5 Reserved C6 Reserved C7 Reserved N7 Reserved P7 Reserved A8 Reserved N8 Reserved A9 Reserved N9 A10 Reserved B10 Reserved B11 Reserved N10 Reserved A11 Reserved N11 Re
Pin A12 B12 D12 N12 P12 D13 E13 F13 G13 H13 J13 K13 L13 M13 N13 A14 D14 F14 G14 H14 J14 K14 F15 H15 J15 Signal Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved I/O - Function Type Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserve
NOTE: DTR pin must be connected in order to enter HE910 V2’s power saving mode. RI pin must be connected in order to wake up the host when a call is coming in sleep mode of host. NOTE: Almost all pins not in use must be left disconnected.
NOTE: The pin defined as RES must be considered RESERVED and not connected on any pin in the application. The related area on the application has to be kept empty.
NOTE: The pin defined as RES must be considered RESERVED and not connected on any pin in the application. The related area on the application has to be kept empty.
To turn on the HE910 V2, the pad ON_OFF* must be tied low for at least 1 second and then released. The maximum current that can be drained from the ON_OFF* pad is 0.1 mA. A simple circuit to power on the module is illustrated below: Upon turning on HE910 V2 module, the HE910 V2 module is not active yet because the boot sequence of HE910 V2 is still executing internally. It takes about 10 seconds to complete the initialization of the module internally.
During the Initialization state, any kind of AT-command is not available. DTE must wait for the Activation state to communicate with HE910 V2. To check if the HE910 V2 has powered on, the hardware line PWRMON must be monitored. When PWRMON goes high, the module has powered on. NOTE: Do not use any pull up resistor on the ON_OFF* line. It is pulled up internally. Using a pull up resistor may bring latch up problems on the HE910 V2 power regulator and improper power on/off of the module.
2. To drive the ON_OFF* pad directly with an ON/OFF button: Turning off the device can be done in two ways: By software command (see HE910 V2 Software User Guide) By hardware shutdown (pad ON_OFF*) When the device is shut down by software command or by hardware shutdown, it issues a detach request to the network that informs the network that the device will no longer be reachable.
The following flow chart shows the proper turnoff procedure: The HE910 V2 can be shut down by a software command. When a shutdown command is sent, the HE910 V2 goes into the finalization state and will shut down PWRMON at the end of this state. The period of the finalization state can vary according to the state of the HE910 V2 so it cannot be fixed definitely. Normally it will be above 10 seconds after sending a shutdown command and DTE should monitor the status of PWRMON to see the actual power off.
TIP: To check if the device has powered off hardware line PWRMON must be monitored. When PWRMON goes low, the device has powered off. 4.2.2. Hardware Shutdown To turn OFF the HE910 V2 the pad ON_OFF* must be tied low for at least 2 seconds and then released. The same circuitry and timing for the power on must be used. When the hold time of ON_OFF* is above 2 seconds, the HE910 V2 goes into the finalization state and will shut down PWRMON at the end of this state.
WARNING: The Hardware Reset must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure to be done in the rare case that the device gets stuck waiting for some network. To unconditionally shutdown the HE910 V2, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released.
For example: To drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): The chart below describes the overall sequences for turning the module ON and OFF.
The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product’s overall performance. Read carefully the requirements and the guidelines that follow for a proper design. The external power supply must be connected to VBATT & VBATT_PA signals and must fulfill the following requirements: Power Supply 3.8V Nominal Supply Voltage 3.4V ~ 4.2V Normal Operating Voltage Range Extended Operating Voltage Range 3.3V ~ 4.
Mode Average(mA) GSM TX and RX mode 600 GPRS 4TX/2RX 450 400 EDGE 4TX/2RX 350 GSM peak current 1800 Mode Description Operating mode GSM850/GSM900, class33 DCS1800/PCS1900, class33 GSM850/GSM900, class33 DCS1800/PCS1900, class33 (*1) The off current is the total supply current from the main battery with the PMIC off and the 32 kHz XTAL oscillator on. (*2) Worst/best case depends on network configuration and is not under module control.
The principal guidelines for the Power Supply Design embrace three different design steps: the electrical design the thermal design the PCB layout The electrical design of the power supply depends strongly on the power source where this power is drained. We will distinguish them into three categories: +5V input (typically PC internal regulator output) +12V input (typically automotive) Battery The desired output for the power supply is 3.
An example of a linear regulator with 5V input: The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and must not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by HE910 V2.
A protection diode must be inserted close to the power input, in order to save HE910 V2 from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the schematic below: The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V. A single 3.7V lithium-ion cell battery type is ideal to supply power to the Telit HE910 V2 module. WARNING: The three battery cells (Ni/Cd or Ni/MH 3.6V nom.
A protection diode must be inserted close to the power input, in order to save HE910 V2 from power polarity inversion. Otherwise the battery connector must be done in a way to avoid polarity inversions when connecting the battery. The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.
conducted to the ground plane under the HE910 V2; you must ensure that your application can dissipate heat. In the WCDMA/HSPA mode, since HE910 V2 emits RF signals continuously during transmission, you must pay special attention how to dissipate the heat generated. The current consumption will be up to about 640mA in HSPA (630mA in WCDMA) continuously at the maximum TX output power (23dBm). Thus, you must arrange the PCB area as large as possible under HE910 V2 which you will mount.
The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (usually 100-500 kHz). The use of a good common ground plane is suggested.
The antenna connection and board layout design are the most important parts in the full product design and they strongly reflect on the product’s overall performances. Read carefully and follow the requirements and the guidelines for a proper design.
Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.
Install the antenna in a place covered by the GSM/WCDMA signal. The Antenna shall be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter; If the device antenna is located greater then 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product.
Depending on the characteristics and requirements unique to the customer’s designs, the use of an external LNA or an external active antenna may be required to achieve best performance. The optional external LNA should be dimensioned to avoid an excessive LNA gain that can introduce jamming, spurious, degrade IIP3, and saturate the receiver.
The external active antenna for the Telit HE910 V2 device must fulfill the following requirements: ACTIVE GPS/GNSS Antenna Requirements Frequency range Bandwidth Impedance LNA NF LNA Gain LNA Input Voltage GNSS(GPS L1 & GLONASS) : 1565 MHz ~ 1606 MHz GPS L1 : 1575.42MHz GLONASS : 1597.55 – 1605.89MHz GPS L1 : +/- 1.023MHz GLONASS : 8.34MHz 50 Ohm < 1dB 14 ~ 17dB 3.0V or 5.0V NOTE: The maximum DC voltage applicable to ANT_GPS pin is 5V.
This line of transmission shall fulfill the following requirements: Antenna Line on PCB Requirements Characteristic Impedance 50Ohm Max Attenuation 0.3dB Coupling with other signals shall be avoided Cold End (Ground Plane) of antenna shall be equipotential to the HE910 V2 ground pads Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements. This device is to be used only for mobile and fixed application.
The HE910 V2 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring, control and data transfers.
The serial ports on the Telit HE910 V2 are the interface between the module and OEM hardware. 2 serial ports are available on the module: Modem Serial Port 1 (Main) Modem Serial Port 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware. The most common are: RS232 PC comport Microcontroller UART@1.8V(Universal Asynchronous Receiver Transmit) Microcontroller UART@5V or other voltages different from 1.
Serial port 1 on the HE910 V2 is a +1.8V UART with all 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Pin Signal I/O Function Type N14 DCD - dcd_uart O Data Carrier Detect 1.8V M15 RXD - Tx_uart O Transmit line *see Note 1.8V N15 TXD - Rx_uart I Receive line *see Note 1.8V M14 DTR - dtr_uart I Data Terminal Ready 1.8V P14 DSR - dsr_uart O Data Set Ready 1.8V L14 RTS - rts_uart I Request to Send 1.
WARNING: Consider a mechanical design and a low-capacitance ESD protection device to protect HE910 V2 or customer specific requirements from ESD event to UART port (M15, N15, P15 and L14). Serial port 2 on the HE910 V2 is a +1.8V UART with only the RX and TX signals. The signals of the HE910 V2 serial port are: PAD Signal I/O Function Type D15 TX_AUX O Auxillary UART (TX Data to DTE) 1.8V E15 RX_AUX I Auxillary UART (RX Data from DTE) 1.
level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
The HE910 V2 module doesn’t support an analog audio interface and supports one Digital Audio bus. In order to develop an application including an Analog Audio it is necessary to add a dedicated CODEC on the Application design. For further information, please refer to the “Digital Voice Interface Application Note”.
The general-purpose I/O pads can be configured to act in three different ways: Input Output Alternate function (internally controlled) Input pads can only be read and report the digital value (high or low) present on the pad at the read time. Output pads can only be written to set the value of the pad or queried. An alternate function pad is internally controlled by the HE910 V2 firmware and acts depending on the function implemented. The following GPIOs are available on the HE910 V2.
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the HE910 V2 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.3V Operating Range - Interface levels (1.8V CMOS) Parameter Min Max Input high level 1.5V 2.1V Input low level 0.0V 0.35V Output high level 1.35V 1.8V Output low level 0.
The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with a 4.7KΩ pull-up resistor to 1.8V.
The Temperature Monitor is a function of the module that permits control of its internal temperature and if properly set (see the #TEMPMON command on AT Interface guide) raises to High Logic level a GPIO when the maximum temperature is reached. The STAT_LED pin status shows information on the network service availability and Call status. In the HE910 V2 modules, the STAT_LED usually needs an external transistor to drive an external LED.
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing only RTC to be active when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NOTE: NO devices must be powered from this pin. A regulated power supply output is provided in order to supply small devices from the module.
The HE910 V2 module provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on pin C13 of the HE910 V2 module and on pin 6 of PL302 on Interface Board (CS1467D). The on board DAC is in the range from 0 to 1023. However, an external low-pass filter is necessary. Parameter Min Max Units Voltage range (filtered) 0 1.
The on board ADC is 8-bit converter. It is able to read a voltage level in the range of 0 ~ 1.2 volts applied on the ADC pin input and store and convert it into 8 bit word. Parameter Min Max Units Input Voltage range 0 1.2 Volt AD conversion - 8 bits Resolution - < 10 mV Input Resistance 1 Mohm The HE910 V2 provides one Analog to Digital Converter.
The HE910 V2 has been designed in order to be compliant with a standard lead-free SMT process.
144 pins < Top View > In order to easily rework the HE910 V2 it is suggested to consider having a 1.5 mm placement inhibit area around the module on the application. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. NOTE: In the customer application, the region under WIRING INHIBIT (see figure) must be clear from signal or ground paths.
Stencil’s apertures layout can be the same as the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB Pad Surfaces: Finish Electro-less Ni / Immersion Au Layer thickness (um) 3 ~ 7 / 0.05 ~ 0.
Lead free Solder Paste Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.
Profile Feature Average ramp-up rate(TL to Tp) Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time(tL) Peak Temperature (Tp) Time within 5℃ of actual Peak Temperature(tp) Ramp-down Rate Time 25℃ to Peak Temperature Pb-Free Assembly 3℃/second max 150℃ 200℃ 60 - 180 seconds 3℃/second max 217℃ 60 - 150 seconds 245 +0/-5℃ 10 - 30 seconds 6℃/sec max 8 minutes max NOTE: All temperatures refer to topside of
The HE910 V2 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. WARNING: These trays can withstand a maximum temperature of 65℃.
The HE910 V2 is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5.
To test and debug the mounting of HE910 V2, we strongly recommend foreseeing test pads on the host PCB, in order to check the connection between the HE910 V2 itself and the application and to test the performance of the module connecting it with an external computer.
When a sudden voltage is asserted to or cut from the power supplies, The steep transition makes some reactions such as the overshoot and undershoot. This abrupt voltage transition can affect the device not to work or make it malfunction. The bypass capacitors are needed to alleviate this behavior and it can be affected differently according to the various applications. The customers have to pay special attention to this when they design their application board.
This section deals with the recommended schematics for the design of SIM interfaces on the application boards. Figure 1 illustrates in particular how the application side should be designed, and what values the components should have. NOTE FOR R1: The resistor value on SIMIO pulled up to SIMVCC should be defined accordingly in order to be compliant to 3GPP specification. For HE910-EUG V2/NAG V2/EU V2/NA V2 contain an internal pull-up resistor on SIMIO.
Telit_SIM_Integration_Design_Guide_Application_Note
One of the following options should be chosen in the design of host system in order to download or upgrade the Telit’s software and debug HE910 V2 when HE910 V2 is already mounted on a host system. Users who use both of UART and USB interfaces to communicate HE910 V2 - Must implement a download method in a host system for upgrading HE910 V2 when it’s mounted.
The HE910-EU V2 and HE910-EUG V2 modules have been assessed in order to satisfy the essential requirements of the R&TTE Directive 1999/05/EC (Radio Equipment & Telecommunications Terminal Equipments) to demonstrate the conformity against the harmonized standards with the final involvement of a Notified Body. In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-EUG V2 is compliant with the following standards: RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1 EN 301 511 V9.0.
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body: AT4 wireless, S.A. Parque Tecnologico de Andalucía C/ Severo Ochoa 2 29590 Campanillas – Málaga SPAIN Notified Body No: 1909 Thus, the following marking is included in the product: The full declaration of conformity can be found on the following address: http://www.telit.
Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
READ CAREFULLY Be sure about that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
Revision 0 1 Date 2013-05-14 2013-11-08 2 2013-11-27 Changes First issue Updated 6.1 GSM/WCDMA Antenna Requirements Updated 8.1 Modem Serial Port 1 Updated 10.5 Indication of Network Service Availability Updated 14.3 SIM Interface Updated 15 Conformity Assessment Issues Updated 2.5 Environmental requirements Updated 6.1 GSM/WCDMA Antenna Requirements Updated 15.
