User's Manual

HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 84 of 84
15.7 Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules
after assembly.
15.7.1 HE910 Solder reflow
Recommended solder reflow profile: