User's Manual

HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 5 of 80
9.1 SPI CONNECTIONS .............................................................................................................................................................. 50
10 SERIAL PORTS .......................................................................................................................................................... 51
10.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 52
10.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 54
10.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 55
11 AUDIO SECTION OVERVIEW .................................................................................................................................... 57
11.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 57
11.1.1 CODEC Examples .................................................................................................................................................. 57
12 GENERAL PURPOSE I/O ........................................................................................................................................... 58
12.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 59
12.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 60
12.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 60
12.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 61
12.5 RTC BYPASS OUT ............................................................................................................................................................. 62
12.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 62
12.7 VAUX POWER OUTPUT ..................................................................................................................................................... 62
13 MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 63
13.1 GENERAL ........................................................................................................................................................................ 63
13.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 63
13.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 64
13.4 STENCIL .......................................................................................................................................................................... 65
13.5 PCB PAD DESIGN .............................................................................................................................................................. 65
13.6 RECOMMENDATIONS FOR PCB PAD DIMENSIONS (MM): .......................................................................................................... 66
13.7 SOLDER PASTE .................................................................................................................................................................. 68
13.7.1 HE910 Solder reflow ............................................................................................................................................. 68
14 PACKING SYSTEM .................................................................................................................................................... 70
14.1 MOISTURE SENSITIVITY ...................................................................................................................................................... 72
15 SAFETY RECOMMANDATIONS ................................................................................................................................. 73
16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 75
16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 75
16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 79