User Manual

HE863 Family Hardware User Guide
1vv0300891 Rev.6
- 2011-04-14
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Reserved. Page 82 of 92
14.1.6. HE863 Family Solder Reflow
The following is the recommended solder reflow profile
NOTE:
All temperatures refer to topside of the package, measured on
the package body surface.
WARNING:
HE863 Family module can accept only one reflow process.