User's Manual

HC864-AUTO Hardware User Guide
1vv0300946 Rev.4 – 2012-12-27
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Reserved. Page 65 of 77
14.2. Clearance Area
14.3. Thermal Dissipation
To permit a better thermal dissipation it is suggested to use a Thermal conductive material
between the module and the application PCB.
Suggested types are Bergquist (Two parts) GAP filler 3500 or GAP Filler 1500