User's Manual

HC864-AUTO Hardware User Guide
1vv0300946 Rev.4 – 2012-12-27
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 63 of 77
14.1. Application PCB layout
To obtain the best thermal dissipation it is suggested to design the host PCB as in the below
image where a Ground area has been created below the module.
Bottom side
Top View