User's Manual

GL865-DUAL/QUAD V3 Hardware User Guide
1vv0301018 Rev.7 – 2013-10-30
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 65 of 78
Mod. 0805 2011-07 Rev.2
Profile Feature Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate 3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature (ttp) 8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
WARNING:
The GL865-DUAL/QUAD V3 module withstands one reflow process only.
13.9. Debug of the GL865-DUAL/QUAD V3 in production
To test and debug the mounting of the GL865-DUAL/QUAD V3, we strongly recommend
foreseeing test pads on the host PCB, in order to check the connection between the GL865-
DUAL/QUAD V3 itself and the application and to test the performance of the module
connecting it with an external computer. Depending by the customer application, these pads
include, but are not limited to the following signals:
• TXD
• RXD
• ON/OFF*
• HW SHUTDOWN*
• GND
• VBATT
• TX_AUX
• RX_AUX
• PWRMON