User's Manual

GL865-DUAL/QUAD V3 Hardware User Guide
1vv0301018 Rev.7 – 2013-10-30
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Reserved. Page 63 of 78
Mod. 0805 2011-07 Rev.2
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested to use milled
contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.
Inhibit area for micro
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via