User's Manual

GE910 Hardware User Guide
GE910 Hardware User GuideGE910 Hardware User Guide
GE910 Hardware User Guide
1vv0300962 Rev.9-bis3 2013-05-20
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 6 of 87
Mod. 0805 2011-07 Rev.2
7.4.8. External LNA Gain and Noise Figure ...........................................................................................................49
7.4.9. Powering the External LNA (active antenna)................................................................................................49
7.4.10. External LNA Enable.....................................................................................................................................50
8. Logic Level Specifications ............................................................................................................................................51
9. USB Port ........................................................................................................................................................................52
9.1. USB 2.0 FS ............................................................................................................................................................52
10. Serial Ports................................................................................................................................................................53
10.1. Modem Serial Port .................................................................................................................................................53
10.2. RS232 level translation ..........................................................................................................................................56
11. Audio Section Overview...........................................................................................................................................58
11.1. Digital Voice Interface (DVI) ................................................................................................................................58
11.1.1. DVI Electrical Connections...........................................................................................................................58
11.2. Analog Front-End...................................................................................................................................................58
11.2.1. MIC connection .............................................................................................................................................58
11.2.2. LINE-IN connection.......................................................................................................................................60
11.2.3. EAR connection .............................................................................................................................................61
11.2.4. Electrical Characteristics..............................................................................................................................63
12. General Purpose I/O.................................................................................................................................................65
12.1. Using a GPIO Pad as INPUT .................................................................................................................................66
12.2. Using a GPIO Pad as OUTPUT .............................................................................................................................66
12.3. Indication of network service availability..............................................................................................................67
12.4. RTC Bypass out .....................................................................................................................................................68
12.5. External SIM Holder Implementation....................................................................................................................68
12.6. ADC Converter ......................................................................................................................................................68
12.6.1. Description....................................................................................................................................................68
12.6.2. Using ADC Converter ...................................................................................................................................68
13. Mounting the GE910 on your Board.......................................................................................................................69
13.1. General...................................................................................................................................................................69
13.2. Module finishing & dimensions.............................................................................................................................69
13.3. Recommended foot print for the application..........................................................................................................70
13.4. Stencil.....................................................................................................................................................................71
13.5. PCB pad design......................................................................................................................................................71
13.6. Recommendations for PCB pad dimensions ..........................................................................................................71
13.7. Solder paste............................................................................................................................................................73
13.7.1. GE910 Solder reflow .....................................................................................................................................73
14. Packing system..........................................................................................................................................................75
14.1. Packing on Reel......................................................................................................................................................75
14.1.1. Carrier Tape Detail.......................................................................................................................................75
14.1.2. Reel Detail.....................................................................................................................................................76
14.1.3. Packaging Detail...........................................................................................................................................77
14.2. Packing on tray.......................................................................................................................................................78
14.3. Moisture sensibility................................................................................................................................................80
15. Conformity Assessment Issues.................................................................................................................................81
16. SAFETY RECOMMANDATIONS.........................................................................................................................86