User Guide

GE9
GE9GE9
GE910 Hardware User Guide
10 Hardware User Guide10 Hardware User Guide
10 Hardware User Guide
1vv0300962 Rev.4 2012-06-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 59 of 73
Mod. 0805 2011-07 Rev.2
12.4. Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
12.5. PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
12.6. Recommendations for PCB pad dimensions (mm):
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)