User's Manual

GE866-DUAL Hardware User Guide
1VV0301051 Rev. 2 – 2014-04-07 7
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Mod. 0805 2011-07 Rev.2
13.8. GE866 Solder reflow
Recommended solder reflow profile
Profile Feature Pb-Free Assembly
Average ramp-
up rate (TL to
TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate 3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual
10-30 seconds