User's Manual

GE866-DUAL Hardware User Guide
1VV0301051 Rev. 2 – 2014-04-07 7
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Mod. 0805 2011-07 Rev.2
tin-lead solder paste on the described surface plating is
better compared to lead-free solder paste.
It is not necessary to panel the application PCB, however in
that case it is suggested to use milled contours and
predrilled board breakouts; scoring or v-cut solutions are not
recommended.
13.7. Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to
avoid the cleaning of the modules after assembly.