User's Manual

GE866-DUAL Hardware User Guide
1VV0301051 Rev. 2 – 2014-04-07 7
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Reserved. Page 68 of 82
Mod. 0805 2011-07 Rev.2
It is not recommended to place via or micro-via not covered by
solder resist in an area of 0,3 mm around the pads unless it
carries the same signal of the pad itself (see following
figure).
Holes in pad are allowed only for blind holes and not for
through holes.
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni /
Immersion Au
3 –7 / 0.05 – 0.15
good solder ability
protection,
high shear force values
The PCB must be able to resist the higher temperatures which
are occurring at the lead-free process. This issue should be
discussed with the PCB-supplier. Generally, the wettability of
Inhibit area for micro
-
via