User's Manual

GE866-DUAL Hardware User Guide
1VV0301051 Rev. 2 – 2014-04-07 7
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Mod. 0805 2011-07 Rev.2
13.4. Stencil
Stencil’s apertures layout can be the same of the recommended
footprint (1:1), we suggest a thickness of stencil foil ≥ 120
µm.
13.5. PCB pad design
Non solder mask defined (NSMD) type is recommended for the
solder pads on the PCB.
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)