User's Manual

GE865 Hardware User Guide
1vv0300799 Rev.11 – 13-07-2010
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It is recommended no microvia without solder resist cover under the module and no
microvia around the pads (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni
/ Immersion Au
3 7 /
0.05 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-
free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.