User's Manual

GE865 Hardware User Guide
1vv0300799 Rev.11 – 13-07-2010
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 70 of 82
13.4 Debug of the GE865 in production
To test and debug the mounting of the GE865, we strongly recommend to foreseen test pads
on the host PCB, in order to check the connection between the GE865 itself and the
application and to test the performance of the module connecting it with an external
computer. Depending by the customer application, these pads include, but are not limited to
the following signals:
TXD
RXD
ON/OFF
RESET
GND
VBATT
TX_AUX
RX_AUX
PWRMON
SERVICE
13.5 Stencil
a thickness of stencil foil ≥ 120µm.