User's Manual

GE864- QUAD Har dwar e User Guide
1vv0300872 Rev.1 2010-04-02
- All Rights Reserved. Page 69 of 77
Recommendations for PCB pad dimensions:
Bal l pitch [mm]
2,5
Sol der r esist opening diam eter A [mm ]
1,150
Metal pad diameter B [mm]
1 ± 0.05
It is recommended no microvia without solder resist cover under the module and no
microvia around the pads (see following figur e).
Holes in pad are allowed only for blind holes and not for thr ough holes.
Recommendations for PCB pad sur faces:
Finish
Layer thickness [µm]
Pr oper ties
Electro- less Ni /
Immer sion Au
3 7 /
0.05 0.15
good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free pr ocess. This issue must be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
14.1.7. Solder Paste
Lead fr ee
Sol der paste
Sn/Ag/Cu