User's Manual

GE864- QUAD Har dwar e User Guide
1vv0300872 Rev.1 2010-04-02
- All Rights Reserved. Page 68 of 77
14.1.4. Debug of the GE864 in Production
To test and debug the mounting of the GE864, we str ongly recommend to for eseen
test pads on the host PCB, in order to check the connection between the GE864 itself
and the application and to test the performance of the module connecting it with an
external computer. Depending by the customer application, these pads include, but
are not limited to the following signals:
TXD
RXD
ON/OFF
RESET
GND
VBATT
TX_TRACE
RX_TRACE
PWRMON
14.1.5. Stencil
Stencil’s apertur es layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120µm.
14.1.6. PCB Pad Design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the
PCB.