User's Manual

GE864- QUAD Har dwar e User Guide
1vv0300872 Rev.1 2010-04-02
- All Rights Reserved. Page 5 of 77
1.1 SELECTION MODE .......................................................................................................................................................... 46
1.2 ELECTRICAL CHARACTERISTICS .......................................................................................................................................... 48
10.1.1. Input Lines Char acter istics ................................................................................................................. 48
1.2.1 Output Lines Character istics ....................................................................................................................... 49
11. EXTERNAL SIM HOLDER IMPLEMENTATION ................................................................................................... 51
12. GENERAL PURPOSE I/O .................................................................................................................................. 52
12.1. GPIO LOGIC LEVELS ....................................................................................................................................... 54
12.2. USING A GPIO PAD AS INPUT ........................................................................................................................ 55
12.3. USING A GPIO PAD AS OUTPUT .................................................................................................................... 55
12.4. USING THE RF TRANSMISSION CONTROL GPIO4 .............................................................................................. 55
12.5. USING THE RFTXMON OUTPUT GPIO5 .......................................................................................................... 55
12.6. USING THE ALARM OUTPUT GPIO6 ................................................................................................................. 56
12.7. USING THE BUZZER OUTPUT GPIO7 ................................................................................................................ 57
12.8. MAGNETIC BUZZER CONCEPTS......................................................................................................................... 58
12.8.1. Short Description .................................................................................................................................. 58
12.8.2. Frequency Behavior .............................................................................................................................. 59
12.8.3. Power Supply Influence ....................................................................................................................... 59
12.8.4. Working Current Influence .................................................................................................................. 59
12.9. USING THE TEMPERATURE MONITOR FUNCTION ............................................................................................... 60
12.9.1. Short Description .................................................................................................................................. 60
12.9.2. Allowed GPIO ......................................................................................................................................... 60
12.10. INDICATION OF NETWORK SERVICE AVAILABILITY ............................................................................................. 61
12.11. RTC BYPASS OUT ........................................................................................................................................... 62
12.12. VAUX1 POWER OUTPUT ................................................................................................................................. 62
13. DAC AND ADC SECTION .................................................................................................................................. 63
13.1. DAC CONVERTER ............................................................................................................................................ 63
13.1.1. Description ............................................................................................................................................. 63
13.1.2. Enabling DAC .......................................................................................................................................... 63
13.1.3. Low Pass Filter Example ..................................................................................................................... 64
13.2. ADC CONVERTER ............................................................................................................................................ 64
13.2.1. Description ............................................................................................................................................. 64
13.2.2. Using ADC Conver ter ............................................................................................................................ 64
14. MOUNTING THE GE864 ON THE BOARD ......................................................................................................... 65
14.1. GENERAL ........................................................................................................................................................ 65
14.1.1. Module Finishing & Dimensions ......................................................................................................... 65
14.1.2. Recommended Foot Print for the Application (GE864) ................................................................... 66
14.1.3. Suggested Inhibit Area ......................................................................................................................... 67
14.1.4. Debug of the GE864 in Production ...................................................................................................... 68
14.1.5. Stencil ..................................................................................................................................................... 68
14.1.6. PCB Pad Design ..................................................................................................................................... 68
14.1.7. Solder Paste ........................................................................................................................................... 69
14.1.8. GE864 Solder Reflow ............................................................................................................................ 70
14.2. PACKING SYSTEM ........................................................................................................................................... 71
GE864 Orientation on the Tray ............................................................................................................................. 72
14.2.1. Moisture Sensibility .............................................................................................................................. 73