User's Manual

GE864
GE864GE864
GE864-
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-QUAD Automotive V2 Hardware User Guide
QUAD Automotive V2 Hardware User GuideQUAD Automotive V2 Hardware User Guide
QUAD Automotive V2 Hardware User Guide
1vv0300840 Rev.3 2010-04-08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 63 of 71
13.7.1.
13.7.1.13.7.1.
13.7.1. GE864 Solder reflow
GE864 Solder reflowGE864 Solder reflow
GE864 Solder reflow
The following is the recommended solder reflow profile
Profile Feature
Profile FeatureProfile Feature
Profile Feature Pb
PbPb
Pb-
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-Free Assembly
Free AssemblyFree Assembly
Free Assembly
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate 3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.