User's Manual

GE864
GE864GE864
GE864-
--
-QUAD Automotive V2 Hardware User Guide
QUAD Automotive V2 Hardware User GuideQUAD Automotive V2 Hardware User Guide
QUAD Automotive V2 Hardware User Guide
1vv0300840 Rev.3 2010-04-08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 62 of 71
It is not recommended to place via or microvia not covered by solder resist in an area of
1,6mm diameter around the pads unless it carries the same signal of the pad itself.
(see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
FinishFinish
Finish Layer thickness [µm]
Layer thickness [µm]Layer thickness [µm]
Layer thickness [µm] Properties
PropertiesProperties
Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
13.7.
13.7.13.7.
13.7. Solder past
Solder pastSolder past
Solder paste
ee
e
Lead free
Lead freeLead free
Lead free
Solder paste
Solder pasteSolder paste
Solder paste Sn/Ag/Cu