User's Manual
GE864
GE864GE864
GE864-
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-QUAD Automotive V2 Hardware User Guide
QUAD Automotive V2 Hardware User GuideQUAD Automotive V2 Hardware User Guide
QUAD Automotive V2 Hardware User Guide
1vv0300840 Rev.3 2010-04-08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 5 of 71
13.4.
13.4.13.4.
13.4. Debug of the GE864 in production
Debug of the GE864 in productionDebug of the GE864 in production
Debug of the GE864 in production ................................
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............ 60
6060
60
13.5.
13.5.13.5.
13.5. Stencil
StencilStencil
Stencil................................
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..................... 60
6060
60
13.6.
13.6.13.6.
13.6. PCB pad design
PCB pad designPCB pad design
PCB pad design ................................
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....... 61
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61
13.7.
13.7.13.7.
13.7. Solder paste
Solder pasteSolder paste
Solder paste ................................
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............ 62
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62
13.7.1.
GE864 Solder reflow.............................................................................................................................63
14.
14.14.
14.
Packing system
Packing systemPacking system
Packing system ................................
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....... 65
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65
14.1.
14.1.14.1.
14.1. GE864 orientation on the tray
GE864 orientation on the trayGE864 orientation on the tray
GE864 orientation on the tray................................
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................... 67
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67
14.2.
14.2.14.2.
14.2. Moisture sensibility
Moisture sensibilityMoisture sensibility
Moisture sensibility ................................
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. 67
6767
67
15.
15.15.
15.
Conformity Assessment Issues
Conformity Assessment IssuesConformity Assessment Issues
Conformity Assessment Issues................................
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................................................................
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................ 68
6868
68
16.
16.16.
16.
SAFETY RECOMMANDATIONS
SAFETY RECOMMANDATIONSSAFETY RECOMMANDATIONS
SAFETY RECOMMANDATIONS ................................
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................. 70
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70