User's Manual

GE864
GE864GE864
GE864-
--
-QUAD V2 / GE864
QUAD V2 / GE864QUAD V2 / GE864
QUAD V2 / GE864-
--
-DUAL V2 Hardware User Guide
DUAL V2 Hardware User GuideDUAL V2 Hardware User Guide
DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved. Page 65 of 73
It is recommended no microvia without solder resist cover under the module and no
microvia around the pads (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
FinishFinish
Finish Layer thickness [µm]
Layer thickness [µm]Layer thickness [µm]
Layer thickness [µm] Properties
PropertiesProperties
Properties
Electro-less Ni
/ Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
12.4.
12.4.12.4.
12.4. Solder
SolderSolder
Solder paste
paste paste
paste
Lead free
Lead freeLead free
Lead free
Solder paste
Solder pasteSolder paste
Solder paste
Sn/Ag/Cu