User's Manual
Table Of Contents
- 1 Overview
- 2 GE864-QUAD V2 Mechanical Dimensions
- 3 GE864-QUAD V2 module connections
- 4 Hardware Commands
- 5 Power Supply
- 6 Antenna
- 7 Logic level specifications
- 8 Serial Ports
- 9 Audio Section Overview
- 10 General Purpose I/O
- 10.1 GPIO Logic levels
- 10.2 Using a GPIO Pad as INPUT
- 10.3 Using a GPIO Pad as OUTPUT
- 10.4 Using the RF Transmission Control GPIO4
- 10.5 Using the RFTXMON Output GPIO5
- 10.6 Using the Alarm Output GPIO6
- 10.7 Using the Buzzer Output GPIO7
- 10.8 Indication of network service availability
- 10.9 RTC Bypass out
- 10.10 External SIM Holder Implementation
- 11 DAC and ADC section
- 12 Conformity Assessment Issues
- 14 Document Change Log
GE864-QUAD V2 Hardware User Guide
1vv0300841 Rev.0.1 24/11/09
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 59 of 65
It is not recommended to place via or microvia not covered by solder resist in an area of 1,6mm
diameter around the pads unless it carries the same signal of the pad itself. (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
11.3.7 Solder paste
Lead free
Solder paste
Sn/Ag/Cu