User's Manual

GE864-QUAD V2 Hardware User Guide
1vv0300841 Rev.0.1 24/11/09
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 4 of 65
9.1.2 Input Lines Characteristics ............................................................................................................ 42
9.2 OUTPUT LINES (Speaker)....................................................................................................43
9.2.1 Short description............................................................................................................................ 43
9.2.2 Output Lines Characteristics.......................................................................................................... 44
10 General Purpose I/O.......................................................................................................45
10.1 GPIO Logic levels .............................................................................................................46
10.2 Using a GPIO Pad as INPUT.............................................................................................47
10.3 Using a GPIO Pad as OUTPUT.........................................................................................47
10.4 Using the RF Transmission Control GPIO4....................................................................47
10.5 Using the RFTXMON Output GPIO5 ................................................................................48
10.6 Using the Alarm Output GPIO6........................................................................................48
10.7 Using the Buzzer Output GPIO7 ......................................................................................48
10.8 Indication of network service availability .......................................................................50
10.9 RTC Bypass out ................................................................................................................51
10.10 External SIM Holder Implementation ..............................................................................51
11 DAC and ADC section....................................................................................................52
11.1 DAC Converter ..................................................................................................................52
11.1.1 Description..................................................................................................................................... 52
11.1.2 Enabling DAC ................................................................................................................................ 53
11.1.3 Low Pass Filter Example ............................................................................................................... 53
11.2 ADC Converter ..................................................................................................................54
11.2.1 Description..................................................................................................................................... 54
11.2.2 Using ADC Converter .................................................................................................................... 54
11.3 Mounting the GE864-QUAD V2 on your Board...............................................................55
11.3.1 General .......................................................................................................................................... 55
11.3.2 Module finishing & dimensions ...................................................................................................... 55
11.3.3 Recommended foot print for the application (GE864) ................................................................... 56
11.3.4 Debug of the GE864 in production ................................................................................................ 57
11.3.5 Stencil ............................................................................................................................................ 57
11.3.6 PCB pad design............................................................................................................................. 58
11.3.7 Solder paste................................................................................................................................... 59
11.3.8 GE864 Solder reflow...................................................................................................................... 60
11.4 Packing system.................................................................................................................61
11.4.1 GE864 orientation on the tray........................................................................................................ 62
11.4.2 Moisture sensibility ........................................................................................................................ 62
12 Conformity Assessment Issues....................................................................................63
13 SAFETY RECOMMANDATIONS.....................................................................................64
14 Document Change Log
..................................................................................................65