User's Manual

GE/GC864-QUAD V2 and GE864-GPS Hardware User Guide
1vv0300915 Rev.2 – 2011-06-15
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Reserved. Page 87 of 97
14.1.5. GE864-QUAD V2/GPS Solder reflow
The following is the recommended solder reflow profile
Profile Feature Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
–
Time (min to max) (ts)
150°C
200°C
60
-
180 seconds
Tsmax to TL
– Ramp-up Rate 3°C/second max
Time maintained above:
– Temperature (TL)
–
Time (tL)
217°C
60
-
150 seconds
Peak Temperature (Tp)
245 +0/
-
5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on
the package body surface
WARNING:
The GE865 module withstands one reflow process only.