User's Manual

GE/GC864-QUAD V2 and GE864-GPS Hardware User Guide
1vv0300915 Rev.2 – 2011-06-15
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Reserved. Page 86 of 97
It is recommended no microvia without solder resist cover
under the module and no microvia around the pads (see
following figure).
Holes in pad are allowed only for blind holes and not for
through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness
[µm]
Properties
Electro-
less
Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability
protection,
high shear force
values
The PCB must be able to resist the higher temperatures which
are occurring at the lead-free process. This issue should be
discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is
better compared to lead-free solder paste.
14.1.4. Solder paste
Lead free
Solder paste
Sn/Ag/Cu
It is recommended to use only “no clean” solder paste in
order to avoid the cleaning of the modules after assembly.