User's Manual

GE/GC864-QUAD V2 and GE864-GPS Hardware User Guide
1vv0300915 Rev.2 – 2011-06-15
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights
Reserved. Page 85 of 97
NOTE:
In order to easily rework the GE864-QUAD V2 module is
suggested to consider on the application a 1.5mm inhibit area
around the module.
It is also suggested, as common rule for a SMT component, to
avoid having a mechanical part of the application in direct
contact with the module.
14.1.2. Stencil
Stencil apertures layout can be the same of the recommended
footprint (1:1), we suggest a thickness of stencil foil >120µm.
14.1.3. PCB pad design
Non solder mask defined” (NSMD) type is recommended for the
solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm] 2,4
Solder resist opening
diameter A [mm]
1,150
Metal pad diameter B [mm] 1 ± 0.05