User's Manual

DE910 Series Hardware User Guide
1vv0301183 Rev.1 – 2015-2-13
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 7 of 70
13. Mounting the Module on your Board ........................... 58
13.1. General ................................................ 58
13.2. Module Finishing & Dimensions .......................... 58
13.3. Recommended foot print for the application ............. 59
13.4. PCB Pad Design ......................................... 59
13.5. Recommendations for PCB Pad Dimensions (mm) ............ 60
13.6. Solder Paste ........................................... 61
13.6.1. Solder Reflow ............................................ 61
14. Packing System .............................................. 63
14.1. Reel ................................................... 63
14.1.1. Carrier Tape Detail ...................................... 63
14.1.2. Reel Detail .............................................. 63
14.1.3. Packaging Detail ......................................... 63
14.2. Moisture Sensibility ................................... 64
15. Application Design Guide .................................... 65
15.1. Download and Debug Port ................................ 65
16. Certifications and Conformity ............................... 66
17. Safety Recommendations ...................................... 69
18. Document History ............................................ 70