User's Manual

DE910 Series Hardware User Guide
1vv0301183 Rev.1 – 2015-2-13
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Reserved. Page 61 of 70
13.6. Solder Paste
Solder Paste Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
13.6.1. Solder Reflow
The following is the recommended solder reflow profile:
Profile Feature Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3℃/second max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
150℃
200℃
60 ~ 180 seconds
Tsmax to TL
- Ramp-up Rate
3℃/second max
Time maintained above:
- Temperature (TL)
- Time (tL)
217℃
60 ~150 seconds