User's Manual

DE910 Series Hardware User Guide
1vv0301183 Rev.1 – 2015-2-13
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 60 of 70
13.5. Recommendations for PCB Pad Dimensions (mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3
mm around the pads unless it carries the same signal as the pad itself (see following figure).
Description Diameter [mm]
Solder resist opening A
1.9
Except for ANT and VBATT
2.3
Metal pad B 1.6 2.0
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish Layer thickness (um) Properties
Electro-less Ni / Immersion Au 3 ~ 7 / 0.05 ~ 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is better compared to lead-free solder
paste.