User's Manual

DE910 Series Hardware User Guide
1vv0300951 Rev.9 – 2015-05-11
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Reserved. Page 64 of 77
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish Layer thickness (um) Properties
Electro-less Ni / Immersion Au 3 ~ 7 / 0.05 ~ 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is better compared to lead-free solder
paste.