User's Manual
DE910 Series Hardware User Guide
1vv0300951 Rev.9 – 2015-05-11
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Reserved. Page 63 of 77
13.4. Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). we suggest a
thickness of stencil foil ≥ 120 µm.
13.5. PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
13.6. Recommendations for PCB Pad Dimensions (mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3
mm around the pads unless it carries the same signal as the pad itself (see following figure).