User's Manual

CL865-DUAL Hardware User Guide
1vv0301104 Rev.1 – 2014-03-07
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Reserved. Page 59 of 70
Mod. 0805 2011-07 Rev.2
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni / Immersion Au
3 –7 / 0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested to use milled
contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.
13.7. Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of
the modules after assembly.
13.8. CL865 Solder reflow
Recommended solder reflow profile
TL
Tsmin
Tsmax
ts
tL
tp
ttp