User's Manual

CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 7 of 75
13.1. General ..................................................... 59
13.2. Module Finishing & Dimensions ............................... 59
13.3. Recommended foot print for the application .................. 60
13.4. Stencil ..................................................... 61
13.5. PCB Pad Design .............................................. 61
13.6. Recommendations for PCB Pad Dimensions (mm) ................. 61
13.7. Solder Paste ................................................ 63
13.7.1. Solder Reflow .................................................. 63
14. Packing System ................................................... 65
14.1. Moisture Sensibility ........................................ 67
15. Application Design Guide ......................................... 68
15.1. Download and Debug Port ..................................... 68
16. Conformity Assessment Issues(Problèmes d'évaluation de conformité) 69
17. Safety Recommendations ........................................... 73
18. Document History ................................................. 74