User's Manual

CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 63 of 75
13.7. Solder Paste
Lead free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after
assembly.
13.7.1. Solder Reflow
The following is the recommended solder reflow profile:
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3℃/second max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
150℃
200℃
60 ~ 180 seconds
Tsmax to TL
- Ramp-up Rate
3℃/second max
Time maintained above:
- Temperature (TL)
- Time (tL)
217℃
60 ~150 seconds