User's Manual

CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 62 of 75
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish
Layer thickness (um)
Properties
Electro-less Ni / Immersion Au
3 ~ 7 / 0.05 ~ 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.