User's Manual

CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 61 of 75
13.4. Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). A suggested thickness
of stencil foil ≥ 120 µm.
13.5. PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
Solder maskCopper pad
Solder Mask Defined
Copper pad
Non Solder Mask Defined
13.6. Recommendations for PCB Pad Dimensions (mm)
The recommendation for the PCB pads dimensions are described in the following image(dimensions
in mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm
around the pads unless it carries the same signal as the pad itself (see following figure).