User's Manual

CE910-DUAL Hardware User Guide
1vv0301010 Rev .0 – 2012-07-10
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 7 of 63
12.4. Stencil ..................................................................................................................... 53
12.5. PCB Pad Design ...................................................................................................... 53
12.6. Recommendations for PCB Pad Dimensions (mm) ............................................... 53
12.7. Solder Paste ........................................................................................................... 55
12.7.1. Solder Reflow ................................................................................................................... 55
12.8. Debug in production ............................................................................................... 56
13. Packing System ........................................................................................................... 57
13.1. Tray Drawing .......................................................................................................... 57
13.2. Moisture Sensibility ................................................................................................ 57
14. Application Design Guide ............................................................................................ 58
14.1. Download and Debug Port ...................................................................................... 58
15. Conformity Assessment Issues (Problèmes d'évaluation de conformité) .................. 59
16. Safety Recommendations ............................................................................................ 62
17. Document History ........................................................................................................ 63