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User Manual

ManualsBrandsTelit Communications ManualsElectronicsQuad-Band GSM/GPRS module -Model: GE863-PRO3
71727374757677787980
GE863-PRO
3
Hardware User Guide
1vv0300773a Rev. 1 DRAFT -
24/04/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 74 of 82
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer thickness [µm] Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection, high
shear force values
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
11.1.4 Solder paste
Lead free
Solder paste
Sn/Ag/Cu