User Manual

GE863-PRO
3
Hardware User Guide
1vv0300773a Rev. 1 DRAFT - 24/04/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 73 of 82
11.1.2 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
11.1.3 PCB pad Design
“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
2,4
Solder resist opening diameter A [mm]
1,10
Metal pad diameter B [mm]
1 ± 0.05
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
opening”, unless the microvia carry the same signal of the pad itself.