User manual AN-16052600-E3 Ver 1.2.0 2016/9/26 This document is the assembly and maintenance guide for Telink Test System 2.1.
Assembly And Maintenance Manual for Telink Test System 2.1 Published by Telink Semiconductor Bldg 3, 1500 Zuchongzhi Rd, Zhangjiang Hi-Tech Park, Shanghai, China © Telink Semiconductor All Right Reserved Legal Disclaimer Telink Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design.
Assembly And Maintenance Manual for Telink Test System 2.1 Revision History Version Major Changes Date Author 1.0.0 Initial release 2016/5 H.Z.F., L.X., Cynthia 2016/8 T.J.B., Cynthia 2016/9 H.Z.F., Cynthia Updated buzzer related contents, including: buzzer module photo, cable connection between buzzer 1.1.0 and EVK daughter board, cable connection chart, test system photo, Amic test item, buzzer spec in hardware list, and dimension chart of buzzer board. 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 Table of contents 1 Overall Architecture Of 1x1 Test System 2.1 .......................................................... 5 2 Hardware Platform Building ................................................................................... 7 2.1 Check External Antenna ................................................................................... 7 2.2 Cable connection ........................................................................
Assembly And Maintenance Manual for Telink Test System 2.1 Table of figures Figure 1 EVK daughter board............................................................................... 5 Figure 2 PCB antenna board and RF cable .......................................................... 5 Figure 3 Buzzer module ....................................................................................... 6 Figure 4 System connection chart .......................................................................
Assembly And Maintenance Manual for Telink Test System 2.1 1 Overall Architecture Of 1x1 Test System 2.1 Telink Test System 2.1 consists of test bench and mechanical structure. The test bench includes hardware platform and firmware folder, and it’s provided by Telink; while customer needs to make the mechanical structure suitable for DUT (Device Under Test), and connect cables according to the guide in this document. A set of 1x1 Test Bench mainly contains the following hardware resources.
Assembly And Maintenance Manual for Telink Test System 2.1 The buzzer module is used for Amic test, and it should be placed as close to Amic as possible. Note: Do not contact buzzer board with Amic directly, and there should be no obstacle between them. 4) A PC. On PC side, the EvkMonitor tool can be used to burn firmware for EVK daughter board (refer to Section 3), and user can also observe test result via the EvkMonitor (refer to Section 4). Figure below shows the system connection chart.
Assembly And Maintenance Manual for Telink Test System 2.1 2 Hardware Platform Building 2.1 Check External Antenna Telink test bench adopts external antenna for RF test. Customer needs to check the antenna consistency of various jigs. Figure 5 shows the PCB antenna supplied by Telink. Figure 5 Telink PCB antenna board Figure 6 shows dimensions in mm of the PCB antenna supplied by Telink. Figure 6 AN-16052600-E3 Telink PCB antenna dimensions 7 Ver 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 2.2 Cable connection 2.2.1 Connection points on EVK daughter board Figure 7 marks connection points on EVK daughter board to be connected with DUT, PCB antenna and mechanical structure in any application. RF LED4 RED LED2 Yellow LED1 Green LED3 White PIN45 PIN48 Button SWM 3V3DUT GND GND Figure 7 AN-16052600-E3 GND Connection points on EVK daughter board 8 Ver 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 2.2.2 Cable connection between EVK daughter board and PCB antenna The connection point “RF” on EVK daughter board should be connected with PCB antenna board via an RF cable. 2.2.3 Cable connection between EVK daughter board and buzzer Table 1 shows the connection correspondence between EVK daughter board and buzzer board.
Assembly And Maintenance Manual for Telink Test System 2.1 2.2.5 Cable connection between EVK daughter board and DUT Table 3 shows the connection correspondence between EVK daughter board and DUT. Table 3 Cable connection between EVK and DUT Connection points on EVK daughter board Connection points on DUT 3V3DUT BAT+ GND BAT- SWM SWS (DUT) If the DUT is a remote control board, it’s also needed to connect wakeup pin of the DUT with PIN45 of the EVK board.
Assembly And Maintenance Manual for Telink Test System 2.1 2.2.6 Other cable connection EVK daughter board should be connected with PC via an USB cable. User can burn firmware for the EVK daughter board and observe test result via the EvkMonitor tool on PC side (refer to Section 3 and Section 4). PCB Antenna DUT Buzzer EVK Figure 9 AN-16052600-E3 Test System 2.1 11 Ver 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 3 Firmware Burning For EVK Daughter Board 3.1 Folder structure for Test Bench Firmware Telink test bench firmware folder is generally named as “System_V3.0_xxx”. The structure of the “System_V3.0_xxx” folder is shown as below: “DB”: This folder contains db files. “Sch”: This folder contains schematics, cable connection illustration, and etc.
Assembly And Maintenance Manual for Telink Test System 2.1 Double click “tlsr8266f512et32_1x1Jig_2in1” to open the following interface. test.tls: Jig test script to determine PCBA test items. product.ini: EVK product information to determine PCBA RF test frequency point and ID. boot.bin: Image file to download into PCBA finally. 2) uart: Double click “uart.bat” to open uart window and display real-time log for the convenience of test status check. Only one uart window is allowed at the same time.
Assembly And Maintenance Manual for Telink Test System 2.1 4) Monitor: This folder contains the “EvkMonitor” tool on PC side. AN-16052600-E3 14 Ver 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 3.2 Firmware burning for EVK daughter board EVK daughter board should be burned with firmware before it’s ready for use. First connect the EVK daughter board with PC via an USB cable, as shown in Figure 10. EVK Connect EVK with PC via USB cable Figure 10 Then Connection chart between EVK daughter board and PC double click the “EvkMonitor.exe” under the “System_V3.0_xxx\Script\Monitor” folder.
Assembly And Maintenance Manual for Telink Test System 2.1 Figure 11 Firmware burning interface 1 for EVK daughter board First click the “Select Project Folder” button and select the target project folder (i.e. the project under “platform”) in the pop-out window. The selected project path will be available in the box next to the “Select Project Folder” button; test script and product configuration information files will be available in the “test.tls” and “product.ini” editing window, respectively. test.
Assembly And Maintenance Manual for Telink Test System 2.1 During first time of firmware burning, it’s needed to configure product information (product.ini) for the EVK daughter board. Tick the “USB Id” box and set “Evk number” as “0” (always). Then click the “Download” button to start burning. The log window keeps scrolling until it’s as shown in the figure below. Now the EVK daughter board is already burned with evk_testbench.bin, test.tls, product.ini, id and other bin files in the folder.
Assembly And Maintenance Manual for Telink Test System 2.1 4 Observe Test Result Via PC Software EvkMonitor Double click the “Monitor” folder under “System_V3.0_xxx\Script”. Double click the “EvkMonitor.exe” to open the software interface.
Assembly And Maintenance Manual for Telink Test System 2.1 show log: Tick the “show log” box (as shown in mark 1 of Figure 13) to enable the “log window” to display dynamic information. log window: As shown in mark 2 of Figure 13, it’s the area to display dynamic information. Stop: As shown in mark 3 of Figure 13, the software is in the state of stop by default.
Assembly And Maintenance Manual for Telink Test System 2.1 status: As shown in mark 7 of Figure 13, it serves to display running state of the EVK. The figure above indicates the state of “Ongoing”. The figure above indicates the state of “Success”. The figure above indicates the state of “Failure”. For convenience of subsequent maintenance, it’s highly recommended to mark the error items and classify them. data: As shown in mark 8 of Figure 13, it serves to display test result.
Assembly And Maintenance Manual for Telink Test System 2.1 5 Update PCBA (DUT) Firmware Connect the EVK daughter board with PC via an USB cable. Double click the “EvkMonitor.exe” under the folder “System_V3.0_20160316\Script\Monitor”. Click “download” under the menu “Evk” to open the burning interface. To update firmware only, it’s not needed to modify test.tls and product.ini for the EVK daughter board. 1. Tick the box in front of “Burning file”.
Assembly And Maintenance Manual for Telink Test System 2.1 next to the “MD5”. 2. Click the “Download” button. The target bin file automatically replaces the previous boot.bin under the project directory, and it will be burned into the EVK daughter board. After firmware is burned, user can check if the firmware is successfully updated in the EVK daughter board by clicking the “Check boot.bin” button. The result will be available in the log window and the box next to the “Check boot.bin” button.
Assembly And Maintenance Manual for Telink Test System 2.
Assembly And Maintenance Manual for Telink Test System 2.1 Index Name 12 RxLoCnt 13 RxLoPower 14 RxLoCurrent 15 RxHiCnt 16 RxHiPower 17 RxHiCurrent 18 CancleFlashProtection 19 FlashZero 20 FlashErase 21 DsSlpCur 22 DsSlpWkp 23 SuspendCur 24 SuspendWkp AN-16052600-E3 Parameter Description rx low frequency counting value/power/current test: DUT receives packets transmitted by EVK at low frequency point, and thus to test DUT Rx performance at low frequency point.
Assembly And Maintenance Manual for Telink Test System 2.1 Index 25 26 Parameter Description IRCur IR current test: Make DUT enter IR state via EVK and test the current at IR state. current value IR current problem. Check IR circuit. Amic Amic test: 3V3DUT of EVK supplies power for buzzer, while PIN48 outputs high level to make buzzer board generate square wave signal which drives buzzer to beep. Test DUT register value at this state.
Assembly And Maintenance Manual for Telink Test System 2.1 Appendix 2：Hardware List Type Number Spec EVK daughter board External antenna board Buzzer board Long RF cable Dupont cable 1 1 1 1 Several C1T42A20_V3.3 ANT_01 C1T64A3_V2.0 SMA-MMCX dual-shielded cable -30cm Mini USB cable 1 AN-16052600-E3 USB2.0/28AWG/30cm, 30V/80℃/A3-B 26 Ver 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 Appendix 3：Dimension chart of EVK daughter board and buzzer board Figure 14 AN-16052600-E3 Dimension chart of EVK daughter board 27 Ver 1.2.
Assembly And Maintenance Manual for Telink Test System 2.1 Figure 15 AN-16052600-E3 Dimension chart of buzzer board 28 Ver 1.2.
FCC Statement： Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference,and (2) this device must accept any interference received, including interference that may cause undesired operation.
