Datasheet

Over
v
Inter-
C
dfi
d
e
fi
n
e
chip c
o
syste
m
transf
e
embe
d
board
chip c
o
lti
mu
lti
-
c
Teled
y
these
signal
s
be us
e
levels
.
Th
Th
e e
m
can b
e
conn
e
Probi
n
compl
The U
wires)
USB
USB
a
Embedded USB Probe
Embedded
USB
Probe
v
iew
C
hip USB (IC-USB) specification (Reference A)
t d d thdl f i USBi hi
t
e
s a s
t
an
d
ar
d
me
th
o
d
o
l
ogy
f
or us
i
ng
USB
i
n c
hi
p-
t
o-
o
mmunications. It is used in the embedded
m
s market as a replacement for i2C to control data
e
rs between endpoint functions within an
d
ded device. IC-USB allows vendors to leverage on-
embedded USB host logic to enable faster chip-to-
o
mmunications using USB physical links within a
hi PCB bl
chi
p
PCB
assem
bl
y.
y
ne LeCroy’s embedded probe supports tapping
chip-to-chip links using low or full speed Inter-chip
s
at all defined IC-USB voltages. The probe can also
e
d to tap USB 2.0 links at standard 3.3 volt signal
.
b dd d b tili 4
ihd l tht
mb
e
dd
e
d
pro
b
e u
tili
zes a
4
-w
i
re
h
ea
d
er p
l
ug
th
a
t
e
attached as a solder down tap or as flying lead
e
ction attached directly to header pins on the DUT.
n
g techniques above can be used for both USB 2.0
iant electrical links or low/full speed Inter-chip links.
SB protocol traffic can be monitored (via the D+/D-
by attaching the probe to the “A” port of a LeCroy
l
a
na
l
yzer.